摘要
利用超音速气雾化装置制备了Sn0.3Ag0.7Cu无铅焊锡粉末,用扫描电子显微镜和激光粒度分析仪对粉末的微观形貌和粒度分布进行表征,并提出一种反应质量差法计算粉末的氧含量,分析了雾化气体压力对粉末有效雾化率、微观形貌、粒度分布以及氧化程度的影响。结果表明:雾化气体压力对粉末的有效雾化率、微观形貌、粒度分布影响较大。粉末的有效雾化率随雾化气体压力的增加而不断提高;相对高的气压下粉末球形度好,0.6 MPa压力下雾化粉末的球形度好且无团聚;随着雾化气体压力的增大,粉末不断细化,且随着雾化压力的提高,粉末粒度减小幅度逐渐变缓;粉末中的氧含量随雾化气体压力的增大略有增加,高的氧含量使粉末表面粗糙度增大。
Sn0.3Ag0.7Cu lead-free solder powders were prepared by supersonic gas atomization equipment, The scanning electron microscope and laser particle size analyzer were used to characterize the microstructure and size distribution of the powder, respectively. The method of mass difference after reaction between solder powders was used to calculate the oxygen content of powders. The effects of gas pressure on the effective atomization rate, pow-der microstructure, size distribution and oxygen content were investigated. The results indicate that the gas pres-sure has great influence on the effective atomization rate, powder microstructure and size distribution of the pow-ders. The effective atomization rate increases with the gas pressure increasing. The sphericity of the powders is better under higher gas pressure, while it is best when the gas pressure is 0.6 MPa. The powder size becomes smaller as the gas pressure increasing, which decreases slowly under higher pressure. The oxygen content of the powders increases slightly with the gas pressure increasing, causing bad powder surface.
出处
《粉末冶金工业》
CAS
北大核心
2015年第4期20-25,共6页
Powder Metallurgy Industry
基金
陕西省教育厅自然科学专项资金资助项目(02JK133)
