摘要
固体材料通常会随温度变化产生膨胀或收缩行为,然而,材料的热胀冷缩会降低精密部件的结构稳定性和安全可靠性,甚至破坏材料的功能特性。在光学仪器、微电子器件、航空航天等高技术领域,我们迫切需要形状和尺寸不随温度变化的材料,以保证其构件具有高的尺寸稳定性、精密性和长的使用寿命,而低(近零)热膨胀材料的微观尺寸随温度变化近似保持不变,可以在特定温度区域内保持体积既不膨胀也不冷缩,负膨胀材料则是一种具有"热缩冷胀"性能的材料,因此此类材料的研究日益受到重视。概述了反常(负或近零)热膨胀材料的研究与发展历程,主要针对目前国内外研究较多的几类负热膨胀体系的研究工作做了论述,并探讨了该研究领域仍存在的问题以及未来可能的发展方向。
Solid materials usually show expansion or contraction behavior in response to changes in temperature. However, thermal expansion behavior always reduces the stability and safe reliability of precision parts, and even destroys the functional features of the materials. In the fields of optical instruments, mieroelectronic devices, aerospace and others, we desperately need the materials for which the shape and size keep unchanged with temperature, in order to ensure high di- mensional stability, precision and long service life. The low or near zero thermal expansion materials have the performance that their microstrueture size can change hardly with temperature and they can keep the volume either thermal dilation or cool shrink in the area of specific temperature, the negative thermal expansion materials have the performance of thermal shrink and eool dilation. Therefore, the research on the abnormal thermal expansion materials has attracted more and more attention. This paper outlines the research and development of abnormal ( negative or near zero) thermal expansion materials, especially, focusing on several popular classes in this system. We further discussed the existent problems and the direction of future development in this research field.
出处
《中国材料进展》
CAS
CSCD
北大核心
2015年第7期497-502,543,共6页
Materials China
基金
国家自然科学基金资助项目(51172012,51472017)