期刊文献+

铝添加剂对镀钛金刚石/铜复合材料热学性能的影响

THE INFLUENCE OF ADDITIVE ALUMINUM OF THE THERMAL PROPERTIES OF TI-DIAMOND/COPPER COMPOSITES
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摘要 针对添加剂铝能够改善镀钛金刚石/铜的界面粘附力,研究了不同体积分数铝的加入对金刚石-铜的界面、微观结构、界面产物的形成以及热性能的影响。结果表明:铝的加入在金刚石-铜界面之间形成了金属间化合物Al_5 CuTi_2和AlCu_2Ti,金属间化合物的形成明显地改善了金刚石-铜的界面浸润性,提高了复合材料的致密度。然而,随着铝体积分数的增加,复合材料的热导率反而降低,是由于金属间化合物的形成阻碍了有效传热界面,增加了热阻造成的。当铝和金刚石体为分别为2 vol.%和75 vol.%时,样品最高热导率达到了570 W/(m·K)。 The additive aluminum is proposed to improve interfacial bonding between Ti — diamond particles and copper— matrix for Ti — diamond/copper composites.The microstructures,thermal properties,interface reaction production and its effect of the different volume fraction of additive aluminum on the properties of the composites are investigated.The results show that the interfacial bonding of the composites could be strengthened by changing the volume fraction of aluminum,which is attributed to forming intermetallic compounds(Al_5 CuTi_2 and AlCu_2Ti) on the interface between diamond and copper.At the same time,the relative density of diamond/copper composites is improved.However,thermal conductivity of diamond/Cu composites is reducing with the increase of volume fraction of Al,the formation of intermetallic compounds could hindered the effective interface of heat transfer due to increasing thermal resistance.The volume fraction of diamond and aluminum is designed to 2 vol.%and 75 vol.%,respectively,the highest thermal conductivity of sample reaches to 570 W/(m ? K).
出处 《真空与低温》 2015年第4期231-235,共5页 Vacuum and Cryogenics
关键词 热性能 金刚石/铜复合材料 镀钛层 thermal property diamond/Cu composites titanium coating
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参考文献9

  • 1张荣博,陈学康,王兰喜,王晓毅.高导热金刚石/铜复合热沉的研究[J].真空与低温,2012,18(4):210-214. 被引量:8
  • 2Chu Ke,Jia Chengchang,Tian Wenhuai, et al. Thermal conductivityof spark plasma sintering consolidated SiCp/ Al compositescontaining pores: Numerical study and experimentalvalidation[J]. Composites Part A: Applied Science and Manufacturing,2010,41(1):161-167.
  • 3Stubblefied M, Pang S S, Cundy V A. Heat loss in insulatedpipe the influence of thermal contact resistance: A case study[J]. Composites Part B: Engineering,1996,27(1):85-93.
  • 4Shiren Wang ,Jingjing Qiu. Enhancing thermal conductivity ofglass fiber/ polymer composites through carbon nanotubes incorporation[J]. Composites Part B: Engineering, 2010,41(7):533-536.
  • 5Cardarelli F. Materials Handbook[M]. London: Springer,2008:173.
  • 6夏扬,宋月清,林晨光,崔舜,方针正.Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials[J].中国有色金属学会会刊:英文版,2009,19(5):1161-1166. 被引量:16
  • 7Chu Ke,Liu Zhaofang,Jia Chengchang. Thermal conductivityof SPS consolidated Cu/ diamond composites with Cr-coateddiamond particles [J]. Journal of Alloys and Compounds,2010,490(1-2):453-458.
  • 8Naidich J V. Kolesnichenko In: Belyaev Al (ed) Surfacephenomena in metallurgical processes[P]. Unitied States Patent,3214286, 1965.
  • 9Davis L C, Artz B E. Thermal conductivity of metal-matrixcomposites[J]. Journal of Applied, 1995 (77), 4954 -4960.

二级参考文献27

  • 1夏扬,宋月清,林晨光,崔舜.界面对热沉用金刚石-Cu复合材料热导率的影响[J].人工晶体学报,2009,38(1):170-174. 被引量:11
  • 2SCOTT O M,NICHOLAS M.The wetting and bonding of diamonds by copper-base binary alloys[J].J Mater Sci,1975,10:1833-1840.
  • 3POWELL B R,YOUNGBLOOD G E,HASSELMANN D P H,BENTSEN L D.Effect of thermal expansion mismatch on the thermal diffusivity of glass-Ni composites[J].J Am Cerm Soc,1990,63(9/10):581-586.
  • 4HASSELMANN D P H,JOHNSON L F,SYED R,TAYLOR M P,CHYUNGI K.Heat conduction characteristics of a carbon fiber-reinforced lithium-alumino-silicate glass-ceramic[J].J Mater Sci,1987,22:701-709.
  • 5SCHUBERT T,CIUPI-SKI -,ZIELI-SKI W,MICHALSKI A,WEIβG-RBER T,KIEBACK B.Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink application[J].Scripta Materialia,2008,58:263-266.
  • 6FLAQUER J,RíOS A,MARTIN-MEIZISO A,NOGALES S.Effect of diamond shapes and associated thermal boundary resistance on the thermal conductivity of diamond-based composites[J].Computational Materials Science,2007,41(2):156-163.
  • 7KLEINER S,KHALID F A,RUCH P W,BEFFORT O.Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminum[J].Scripta Materialia,2006,55:291-294.
  • 8HU Shao-chung,CHANG Kuen-liang,SUNG James.Ultrahigh pressure sintering of polycrystalline diamond cubes[C]// LI Zhi-hong,ZHAO Bo,YI Yun-lei,LIU Yue-lan.Proceedings of the 5th Zhengzhou International Super-Hard Materials & Related Products Conference.Zhengzhou:China Machine Press,2008:70-76.
  • 9WEBER L,TAVANGAR R.On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X(X=Cr,B) diamond composites[J].Scripta Materialia,2007,57:988-991.
  • 10DUNN M,TAYA M.The effective thermal conductivity of composites with coated reinforcement and the application to imperfect interfaces[J].J Apply Phys,1993,73:1711-1722.

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