摘要
采用对苯二胺（p PDA）、4,4’-二氨基二苯醚（ODA）、均苯四甲酸二酐（PMDA）制备了p PDA/ODA-PMDA无规共缩聚型聚酰亚胺薄膜,研究了其树脂合成条件、亚胺化方式以及p PDA含量对PI膜性能的影响。结果表明：聚酰胺酸的黏度与反应温度成反比,化学亚胺法可以提高薄膜的热稳定性;随着p PDA含量的增加,PI薄膜的拉伸强度和尺寸稳定性得到明显改善。当p PDA含量为10%-15%时,PI薄膜的综合性能满足设计要求。
A series of random copolymer polyimide films were prepared from pyromellitic dianhydride （pPDA）, 4,4＇-diaminodiphenyl ether（ODA）, and p-phenylene diamine （PMDA）, and the effects of synthsis condition of resin, imidization methods, and the pPDA content on their properties were studied. The results show that the viscosity was inversely proportional to temperature. The chemical imidization method could improve the thermal stability of PI film. With the increase of pPDA content, the tensile strength and dimensional stability of the PI films are improved obviously. When the pPDA content is 10%- 15%, the comprehensive properties of the PI films can satisfy the requirements.
出处
《绝缘材料》
CAS
北大核心
2015年第8期33-35,40,共4页
Insulating Materials
