Cu-P基急冷钎料的制备及钎焊性能的研究

Preparation and Brazing Performance of Cu-P Based Quench Solders

利用单辊急冷法制备用于铜及铜合金钎焊的Cu76.3P7.5Ni13Sn3Si0.2铜磷基急冷钎料。制得的急冷铜磷基钎料薄带具有良好的韧性,钎焊性能优良。将急冷钎料在680℃的钎焊温度下选择3种保温时间(5、10、15 min)与紫铜进行真空钎焊,重点研究了急冷钎料的润湿性与保温时间的关系以及焊接接头的组织结构及力学性能。结果表明,急冷钎料的熔化温度低,润湿性好,硬度低、易加工,用急冷钎料焊接的接头有较优的接头质量。

Cu76.3P7.5Ni13Sn3Si0.2 Cu-P based composite brazing alloy ribbon was prepared by rapid solidification for transient liquid phase bonding process. The ribbon has good toughness and excellent brazing performance. This foil interlayer is brazed with pure Cu by vacuum brazing at 680 ℃ for 5 min, 10 min and 15 min. The relationship between wettability with soaking time was investigated. The microstructure and mechanical properties of the brazing welding joint was researched. The results show that the rapidly solidificated foil has low melting temperature, good wettability, low hardness and good processing ability. The joint brazed with Cu-P based foil has good mechanical properties.