塑封铜丝键合器件失效机理及其可靠性评价

Failure Mechanism and Reliability Assessment of the Copper Wire Bonding Plastic Package Device

铜丝键合器件因其在成本、导电和导热性能等方面的优势而得到了广泛的应用。但与此同时,它在实际应用中所暴露出的问题也不断地引起了人们的重视,铜丝键合器件的失效机理及其可靠性评价方法的研究成为了一项重要的课题。从总结铜丝的材料特性出发,结合塑封工艺过程及其关键环节,总结了塑封铜丝键合器件的主要失效机理,并给出了一些典型的失效案例,提出了一种铜丝键合工艺质量评价与环境耐久性试验评价相结合的塑封铜丝键合器件的可靠性评价方法。对于分析和改进铜丝键合工艺,以及铜丝键合器件的物料选型和使用防护等都具有重要的意义。

Copper wire bonding devices are widely used due to their advantages on cost, elec- tronical and thermal properties. Meanwhile, their problems exposed in practical application have attracted more and more attention, so the study on the failure mechanisms and reliability evalua- tion method of copper wire devices beenn）es an important issue. Starting from the summary of the material properties of copper wire, and combing with the process and the key link of plastic pack- aging technology, the main failure mechanisms of copper wire bonding devices is summarized, and some typical failure cases are demonstrated. And then, a reliability evaluation method for copper wire bonding devices combining with quality evaluation and environmental durabili- ty evaluation is proposed, which is important for the copper wire bonding technology and the se- lection and precaution of copper wire bonding devices