碳纤维无贵金属化学镀铜一步活化工艺

Study on Process of Electroless Copper Plating on Carbon Fiber Activation Process Without Precious Metals

介绍了碳纤维化学镀工艺流程以及预处理的步骤,采用无贵金属胶体铜一步活化替代传统的两步活化;并研究了时间、温度、振动频率对化学镀反应的影响.扫描电镜观察表面形貌,增重率表示镀铜量,冷热循环法检测镀层结合强度,得到最佳工艺参数.结果表明,胶体铜一步活化碳纤维,可得到均匀、完整、结合力强的镀层,步骤简单、成本低廉.

The process flow of electroless copper plating on carbon fiber and pretreatment is introduced.Copper colloid is used to activate carbon fiber without precious metals.The relationship between time,temperature,vibra-tion frequency and electroless plating is also studied in this paper.The surface morphology is investigated by means of scanning electron microscopy（SEM）,while weight -gain rate is employed to represent the amount of copper,and the bonding force between the coating and the carbon fiber is tested by psychro -thermal cycles to get the optimum process parameters.The results show that the coating obtained by copper colloid activating is uni-form and integral,and has good adhesion.This method is inexpensive and simple.