TO-252封装电磁仿真分析

Analysis of the performance of PCB and bonding wire in TO-252 package

随着工艺尺寸的缩小和工作频率提高,表面贴片式封装技术中的PCB板和键合线都可能对电路的电气特性产生影响,因此有必要对这种封装技术进行信号完整性的分析。文章介绍了一种表面贴片封装TO-252,采用3D电磁仿真软件HFSS进行建模,分析仿真PCB板材、厚度和键合线的长度、拱高、根数及键合线间的距离对封装设计中信号传输的影响,为实物封装设计起指导作用。

With the reduction of process dimension and the development of working frequency, the packaging technology of PCB and bonding wire are likely to impact on the electrical characteristics of the circuit, it is necessary to analyze signal integrity of the packaging technology. This paper introduces a surface-mount package TO-252 and model it by using HFSS. There are some factors that have an impact on signal integrity of the package,such as the material and thickness of PCB, the length of bonding wire, the arch height of bonding wire, the distance between two adjacent bonding wire, the number of bonding wires. They play guiding roles in the physical package.