Thermodynamics and characterization of shape memory Cu-Al-Zn alloys

Cu-Al-Zn形状记忆合金的热力学性能和表征

The thermodynamic properties and the microstructure, hardness and electrical conductivity of shape memory alloys （SMAs） belonging to ternary Cu？Al？Zn system were studied by Muggianu model and experiment, respectively. The isothermal section of phase diagram at 293 K was calculated using Thermo-Calc software. Experiments were conducted by X-ray diffraction, light optic microscopy, scanning electron microscopy with energy dispersive X-ray spectrometry, hardness and electrical conductivity measurements. The calculated values of thermodynamic properties indicate that Cu shows good miscibility with Al and Zn in all investigated alloys. The microstructural analysis of samples reveals that the structure consists of large and polygonal grains.

使用Muggianu模型计算Cu-Al-Zn三元形状记忆合金的热力学性能,通过实验研究其显微组织、硬度和导电性。使用Thermo-Calc软件计算293 K等温截面图,采用X射线衍射、光学显微镜、扫描电镜(SEM)和X射线能谱分析(EDX)、硬度和导电性测试对其性能进行表征。热力学计算结果表明:在所有研究合金中,Cu与Al和Zn具有优良的混溶性。样品的显微结构分析表明其结构由大的多边形晶粒组成。