化学活化诱导碳化钨化学镀镍铜磷三元合金的研究

Investigation on Ni-Cu-P Ternary Alloy by Wolfram Carbide Chemical Plating Induced by Chemical Activation

采用化学活化直接对WC陶瓷粉体进行预处理,并结合低温超声辅助化学镀制备Ni-Cu-P三元合金包覆WC复合粉体。通过场发射扫描电子显微镜(FE-SEM)和能谱仪(EDS)研究原始WC粉体、化学活化预处理WC粉体以及包覆的复合粉体表面形貌及对应的微观区域元素分布,探讨化学活化机理以及Ni-Cu-P三元合金沉积机理。结果表明:预处理后WC陶瓷粉体表面新生微观缺陷的化学表面,形成Ni-Cu-P三元合金沉积的活化中心,且Cu优先在活化中心沉积形成合金镀层内表面,Ni、P元素沉积则贯穿化学镀过程。

Chemical activation was adopted to directly pretreat WC ceramic powder,and low temperature,ultrasonic wave and chemical plating were adopted to prepare WC composite powder coated by Ni-Cu-P ternary alloy.Field emission scanning electron microscopy（FE-SEM）and energy dispersion spectrometry（EDS）were used to explore surface morphology of original powder chemical activation pretreatment of WC powder and coated composite powder and element distribution of corresponding microcosmic region.Meanwhile,chemical activation mechanism and deposition mechanism of Ni-Cu-P ternary alloy were discussed.The results show that the chemical surface created by specific chemical activation pretreatment can act as active centre of Ni-Cu-P ternary alloy deposition;Cu first deposits at active center and forms internal surface of alloy plating layer;deposition of Ni and P elements run through the process of chemical plating.