Preparation of gradient wettability surface by anodization depositing copper hydroxide on copper surface

阳极氧化沉积氢氧化铜法制备梯度润湿铜表面（英文）

A facile route for preparation of gradient wettability surface on copper substrate with contact angle changing from 90.3°to4.2°was developed.The Cu（OH）2 nanoribbon arrays were electrochemically deposited on copper foil via a modified anodization technology,and the growth degree and density of the Cu（OH）2 arrays may be controlled varying with position along the substrate by slowly adding aqueous solution of KOH into the two-electrode cell of an anodization system to form the gradient surface.The prepared surface was water resistant and thermal stable,which could keep its gradient wetting property after being immersed in water bath at 100℃ for 10 h.The results of scanning electron microscopy（SEM）,X-ray diffraction（XRD） and X-ray photoelectron spectroscopy（XPS） demonstrate that the distribution of Cu（OH）2 nanoribbon arrays on copper surface are responsible for the gradient wettability.

提出一种在金属铜上制备梯度润湿表面（接触角变化范围90.3°-4.2°）的简易方法。采用改进的阳极氧化电化学沉积技术,通过向阳极氧化系统的双电极容器中滴加氢氧化钾溶液,使铜箔电极上氢氧化铜纳米带阵列的生长程度与密度随铜箔高度而变化,从而形成润湿性梯度。所制备的润湿梯度铜表面具有耐热耐水特性,当此铜表面置于100℃的水浴中10h后仍保持其润湿性梯度。SEM、XRD和XPS测试结果表明,铜表面的氢氧化铜纳米带阵列的生长特性与分布是形成润湿性梯度的主要原因。