军用倒装焊集成电路的发展和评价标准综述

Development and Evaluation Criteria of the Integrated Circuits for the Military Flip Chip

文章论述了倒装焊集成电路的技术特点,详述了NASA、美军对倒装焊集成电路开展的相关研究工作以及美军标的最新发展情况;针对倒装焊集成电路的失效模式,提出军用倒装焊集成电路相关评价试验方法标准。

Is discussed in this paper. The technical characteristics of flip chip integrated circuit, NASA, the U.S. to flip chip integrated circuit to carry out the related research work and the military standard of the latest development is discussed in detail; for flip chip integrated circuit failure mode, puts forward protection flip chip integrated circuit related evaluation price standard test method.