低介电常数聚酰亚胺薄膜研究进展

Research Advance of Low Dielectric Constant Polyimide Films

依据国内外低介电常数聚酰亚胺(PI)薄膜材料的专利研究情况,综述了近年来低介电常数PI薄膜的制备方法,包括引入含氟取代基、脂环结构、嵌段结构、微孔结构、无机杂化材料等方法制备低介电常数材料。同时,对低介电常数PI薄膜的研究趋势进行了展望。

This paper introduced the latest patent technologies for preparing low dielectric constant polyimide films, focusing on fluorine substituent, alicyclic moieties, the porous structure, inorganic hybrid materials and some problems on the main molecular design. The paper also summarized research and development trend of colorless transparent polyimide films in the future.