高速半导体激光器同轴封装结构参数分析

Analysis of Structure Parameters of the Coaxial Package with High-Speed Semiconductor Lasers

对于高速半导体激光器(LD),由于同轴封装结构参数对高速LD组件耦合效率的影响,导致高速LD的性能下降。为了合理设置高速LD同轴封装结构参数,详细分析高速LD同轴封装结构参数对高速LD组件耦合效率的影响,并得出结论:减少高速LD管帽的高度和透镜的大小,增加透镜的折射率可以提高高速LD封装的耦合效率。

The influence of the coaxial package parameters for the high-speed semiconductor laser （LD） on coupling efficiencies of high-speed LD components results in the decrease of high-speed LD index. In order to set up structure parameters of the high-speed LD modules on coaxial packages, the dependence of the coupling efficieneies of the high-speed LD modules on structure parameters of coaxial package are analyzed in detail, proposing conclusion that the coupling efficiencies of the high-speed LD components can be improved by decreasing the height of the cap or the size of the lens and increasing the refractive index of the lens in the high-speed LD.