谐振式微型电场传感器芯片级真空封装及测试

Chip-level Vacuum Package and Test of Resonant MEMS Electric Field Sensor

为了降低传感器的驱动电压,提高该器件的品质因数和信噪比,该文研究封装材料和工艺对真空封装性能的影响,针对一种微机电系统(MEMS)谐振式微型电场敏感结构芯片,采用独特的共晶键合技术,实现该传感器的芯片级真空封装。实验结果表明,该传感器封装后的品质因数达到了30727.4,是常压封装的500倍;该封装器件具有更低的驱动电压,只需要直流分量100 m V和交流分量60 m Vp-p,与常压测试时相比,分别只有原来的1/200和1/16。

In order to improve the Q（Quality factor） value and SNR（Signal to Noise Ratio） and reduce the driving voltage, chip-level vacuum package of Micro-Electro-Mechanical Systems（MEMS） based resonant miniature electric field sensor is realized. By way of a novel fusion bonding process with nanogetter added, the package cap is successfully bonded with the base substrate in very low pressure. The experimental results show that the Q-value of the sensor increases 500 times to 30727.4 and the driving voltage reduces to 100 m V ＋60 m Vp-p which decreases to 1/200 and 1/16 respectively compared to air pressure.