摘要
本文介绍的表面贴装式集成封装射频器件为无引脚,利用其底面焊盘贴装焊接在印制板上使用的。在研制和生产中需要采用无焊接方式对器件射频性能进行测试;通过多种方案测试夹具试验验证,找到了一种带座弹片接触方式的测试夹具方案,可以满足不大于2GHz的射频性能测试。该测试夹具装拆方便,接触可靠,定位准确且在线可见。
In the article,RF SMD without pin is soldered on the PCB by its bottom pads.We need a solderless way to test the SMD＇s RF performance in the development and production.By means of several test fixture solution verification,we found a test fixture scheme of a spring contact pattern,can satisfy the RF（≤2GHz）performance.The test fixture assembly and disassembly is convenient,as well as reliable contact,accurate positioning and online visible.
出处
《电子科学技术》
2015年第4期482-485,共4页
Electronic Science & Technology
