塑封器件芯片与塑封料界面分层的研究

Delamination research of die and EMC interface of plastic packaging device

针对一款LQFP塑封器件,利用ANSYS有限软件建立了三维模型,根据断裂参数——J积分,讨论分析了芯片/塑封料界面的三种分层区域模型,得到了分层的主要扩展模型,即凸形分层区域,同时提出了一种分层扩展趋势的新模型,进而对凸形分层模型探讨了温度和裂纹半径对器件分层的影响。仿真数据表明,在极端低温或高温下,器件的分层区域容易扩展;而在一定的应力条件下,裂纹扩展的趋势会受到裂纹半径大小的影响。

A specified LQFP package was used as a demonstrator. The three dimensional model was established by finite element software ANSYS. Using the fracture parameter^-J integrality, three models of delaminating area on the die/ EMC interface were discussed and analyzed. Then, the main delamination extension mode was achieved, which was convex dclaminating area. A new delamination extension process was put forward at the same time. The temperature and radius of crack effect on the delamination were discussed based on this convex delamination model. The simulation data show that the delaminating area can be extended easily under the extreme low or high temperatures, and the trend of crack extension is also affected by the radius of crack under the condition of a certain stress.