摘要
电路板上的键合盘的宽度，通常需要是所用的键合线宽的2～3倍，当盘间距很小，但键合线宽相对犬时，PCB力口工过程中就很容易出现盘宽度不够而键合不上线的问题，尤其是当流程中有树脂塞孔时，这种矛盾就显得更加突出。文章分析了此种电路板的制作原理，对键合盘控制，表面处理后短路问题的改善方法，做出了详细的论述。
Normally, width of Bonding Pad should be 2-3 times that of width of bonding wire. In some cases, such as big width of Pad with small space between pads, bonding failure is possible because of small Pads. This contradiction would be obvious when there is resin plugging in the process. The manufacture methods of this kind of PCB and control of the strict Pad width are described in this paper.
出处
《印制电路信息》
2015年第9期14-17,37,共5页
Printed Circuit Information
