摘要
Polyimides （PIs） with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/m^2 with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent.
Polyimides （PIs） with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/m^2 with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent.
基金
financially supported by the Shanghai key R&D Program(No.DZ1100105)
