MEMS阳极键合界面层的力学行为研究进展

Research Progress on Mechanical Behavior of MEMS Anodic Bonding Interlayer

回顾了微纳机电系统(Micro/Nano electro-mechanical system,MEMS/NEMS)器件工业中所用键合技术的发展和应用,总结了作为其中关键键合技术之一的阳极键合在微纳系统中的重要作用及其主要特点,分析了阳极键合的机理以及所涉及的力学问题,如键合力(静电力、表面力等)作用下的表面粘着;电场作用下接触界面处粒子的扩散、反应;键合界面层中的残余应力等。阳极键合界面层的力学行为及特性直接关系到MEMS器件中微机械结构的安全与可靠性。对这些问题的研究,有助于更好地理解阳极键合,为MEMS/NEMS器件的设计、制造加工以及实际应用提供许多有益参考。

The paper gives a review on the development and application of bonding techniques in micro/ nano electro-mechanical system（MEMS/NEMS） industry, and summarizes the importance and the main characteristics of anodic bonding as one of vital important bonding techniques. The paper also points out the mechanical problems involved in anodic bonding, such as surface contact adhesion under bonding force （electrostatic force, surface force, etc. ）, particle diffusion or reaction at contact interface under electrical field, residual stress in the bonding interface, and so on. Mechanical behavior and properties of anodic bonding interface layer are directly related to the safety and reliability of micromechanical struc- tures in MEMS devices. The studies of these problems are helpful to better understand the mechanical behavior of anodic bonding, and also give more informative data for the design, fabrication and practical application of MEMS/NEMS devices.