陶瓷阵列加工研究

The machining research of ceramic arrays

陶瓷阵列的质量直接影响探测器的成像质量及性能。针对高硬度,高脆性的陶瓷的阵列加工进行了研究,采用了多线切割机进行了切割实验,并采用激光共聚焦显微镜对阵列粒子尺寸和切割质量进行了检测分析。根据多线切割材料去除机理,探究线径、切割线速度、工件进给速度等径对加工质量影响。该研究为工程应用中的陶瓷阵列加工提供了技术参考。

The image quality and performance of the detector is decided by the quality of ceramic arrays. In this study, the process of ceramic which is high hardness and high brittleness are studied. The cutting exper- iments are carried out by multi - wire sawing machine. The quality detection of arrays is carried out by laser scanning confocal microscopy. According to material removal mechanism of multi - wire cutting, in this research, we explore the impact of cutting wire diameter, cutting speed, feed rate, etc. on the ma- chining quality. The study of the process of ceramic arrays provides technical reference for engineering applications.