双脉冲电流频率对稀土铜电铸层性能的影响

The Impact of Double-pulse Current Frequencies on the Performance of the Rare Earth Copper Electroforming Layer

电铸用于超精密加工零件,它可调整电沉积金属的物理性质,从而容易制造形状复杂的零件,并且铜电铸工艺具有超强的复制性。目前,铜电铸工艺广泛地被应用于复杂形状的精密工件的制造。通过大量的实验,双向脉冲电铸可得到结构细致紧密的晶体。在稀土铜电铸液中使用正向和反向脉冲频率可以制备一定厚度的铜电铸层,且晶粒的粒径尺寸的大小随着正向脉冲频率的变化而变化。该工艺在制造普通模具和复杂模具时相比较于其他工艺所需要的时间更短。同时,也为我们开发更适合精密电铸的电铸机提供了依据。

Electroforming is used in hyper precise processing as it is able to adjust the physical property of electrodeposited metals which makes it easier to manufacture parts with complex shapes. And the copper electroforming technique has super replicability. Currently, the copper eletroforming technique is widely used in the manufacturing of precision parts with complex shapes. A large amount of experiments show that double-way pulse electroforming could result in crystals with fine and compact structures. Forward and backward pulse frequencies used in the rare earth copper electroforming liquid could result in a certain depth of copper electroforming layer, and the diameter of the crystal grains varies as the pulse frequency does. Compared to other techniques, this technique requires shorter time in manufacturing ordinary and complex molds and also provides the basis for developing the electroforming machine which is more fitted for precise electroforming.