期刊文献+

无电化学沉积法合成铜纳米线

Synthesis of Copper Nanowires by Electroless-Chemical Deposition
下载PDF
导出
摘要 采用无电化学沉积法制备铜纳米线,与电化学沉积法不同,无电化学沉积法不需要在通孔模板的一面溅射一层导电金膜作为阴极,以及持续供给电力才能完成纳米线的合成.考察沉积时间、敏化液等因素对铜纳米线制备的影响.使用扫描电子显微镜(SEM),X射线衍射(XRD)对样品其进行检测,结果表明,无电化学沉积法首先形成纳米粒子,随着沉积时间的延长,纳米粒子逐渐融合形成纳米管、纳米线.制备的铜纳米线为多晶态结构.在没有模板限制的情况下,铜原子自催化生长形成类似于花瓣的结构.用95%乙醇代替水配制的敏化液性质较稳定,但是,与以水配制的敏化液相比,在大约相同的沉积时间条件下较不易形成纳米线. Electroless chemical deposition instead of electrochemical deposition was adopted to prepare copper nanowires in that electroless chemical deposition neither has to sputter a layer of gold as cathode on one side of the through-hole template nor supplies power to complete the synthesis of nanowires.The effect of sensitizing solution and deposition time on the preparation of copper nanowires was discussed.Scanning electron microscopy (SEM)and X-ray diffraction (XRD )were applied to observe the morphologies of the samples.The experimental results showed that nanoparticles were firstly formed in the process of deposition,and then they gradually merged to form nanotubes and nanowires with the increase of deposition time.The copper nanowires prepared by electroless chemical deposition were multi-crystal structures.In the templateless case,the copper atoms grew to form petal-like structures by autocatalysis.The sensitizing solution diluted with 95% ethanol was more stable than that with water,but it was less likely to form nanowires compared to the sensitizing solution with water in about the same deposition time.
出处 《东北大学学报(自然科学版)》 EI CAS CSCD 北大核心 2015年第9期1302-1304,1315,共4页 Journal of Northeastern University(Natural Science)
基金 国家自然科学基金资助项目(51074205)
关键词 无电 化学沉积法 铜纳米线 制备 敏化液 electroless chemical deposition copper nanowire preparation sensitizing solution
  • 相关文献

参考文献9

  • 1Lupu N. Electrodeposited nanowires and their applications [ M]. Croatia : InTech, 2010:61 - 64,86,214 - 215.
  • 2Zhang L D, Fang X S, Ye C H. Controlled growth of nanomaterials [ M ]. Singapore : World Scientific, 2007 : 167 - 175,269 - 272.
  • 3Huang C C, Lo C C, Tseng Y C, et al. Magnetostructural phase transition in electroless-plated Ni nanoarrays [ J ]. Journal of Applied Physics,2011,109 ( 11 ) : 113905 - 1 - 13905 - 7.
  • 4Geckeler K E, Nishide H. Advanced nanomaterials [ M ]. Weinheim :Wiley-VCH,2010:200-202.
  • 5倪星元,姚兰芳,沈军,等.纳米材料制备技术[M].北京:化学工业出版社,2007.
  • 6Shin-Shyan Wu,Wei-Long Liu,Ting-Kan Tsai,Shu-Huei Hsieh,Wen-Jauh Chen.Growth behavior of electroless copper on silicon substrate[J].Journal of University of Science and Technology Beijing,2007,14(1):67-71. 被引量:3
  • 7A.R.NIAZI,李树奎,王迎春,刘金旭,呼陟宇,Zahid USMAN.Parameters optimization of electroless deposition of Cu on Cr-coated diamond[J].Transactions of Nonferrous Metals Society of China,2014,24(1):136-145. 被引量:5
  • 8任鑫,黄新民,张胡海,何美清.化学沉积法制备铜纳米管与纳米线[J].金属功能材料,2006,13(5):1-4. 被引量:3
  • 9赵文珍.材料表面工程导论[M].西安:西安交通大学出版社,1998..

二级参考文献27

  • 1杨防祖,杨斌,陆彬彬,黄令,许书楷,周绍民.以次磷酸钠为还原剂化学镀铜的电化学研究[J].物理化学学报,2006,22(11):1317-1320. 被引量:33
  • 2Foss Jr C A,Hornyak G L,et al.[J].J Phys Chem,1994,98:2963.
  • 3Foss Jr C A,Hornyak G L,et al.[J].J Phys Chem,1992,96:7497.
  • 4Mawiawi D A,Coombs N.[J].J Appl Phys,1991,70:4421
  • 5He J B,Chen W,et al.[J].Appl Surf Sci.2004,221,87.
  • 6De T,Norma R,Rajeshwar K.[J].Electrochim Acta,2002,16:2603.
  • 7Chu S Z,Wada K,Inoue S,Todoroki S.[J].Electrochim Acta,2003,48:3147.
  • 8Jung M,Kim H-G.[J].Electrochim Acta,2004,50:852.
  • 9Rahman I Z,Boboc A,et al.[J].J Magn Magn Mater,2005,290:246.
  • 10Menon V P,Martin C R.[J].Anal Chem,1995,67:1920.

共引文献27

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部