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高填量AlN/EP导热复合材料的制备与性能 被引量:1

Preparation and Properties Analysis of High Loading AlN/EP Thermal Conductive Composites
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摘要 以AlN粉末为填料,并对AlN进行表面处理,然后与环氧树脂进行共混,通过模压制备出AlN/EP导热复合材料。结果表明,复合材料的热导率和介电常数随着AlN填料含量的增加而升高,体积电阻率随着填料含量的增加而降低。将不同粒径和形貌的AlN粉末进行混合搭配,可以将AlN粉末的填充量提高到60%(体积比),热导率也随之提高到2.3 W/m·K。 Used as filler, AtN powder was surface treated, blended with epoxy resin and processed by hot press molding to make thermal conductive composites. The results show that, with the increase of the content of AlN fillers, the thermal conductivity and dielectric constant of the composite increases, while the bulk resistivity decrease. By mixing AlN powders with different particle size and different morphology, the AlN volume fraction increases to 60%, and the thermal conductivity of the composites increases to 2.3 W/m. K.
出处 《真空电子技术》 2015年第4期33-35,51,共4页 Vacuum Electronics
关键词 氮化铝 环氧树脂 热导率 介电性能 Aluminium nitride, Epoxy resin, Thermal conductivity, Dielectric property
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参考文献14

  • 1HSIEH C Y, CHUNG S L. High Thermal Conductivity Epoxy Molding Compound Filled with a Combustion Synthesized A1N Powder [J]. Journal of Applied Poly- mer Science, 2006, 102(5) : 4734-4740.
  • 2NG K Y, Yoganandan S A L N. System and Method for Enhanced LED Thermal Conductivity [ P]. US: 6921927, 2005-07-26.
  • 3SHABANY Y. Component Size and Effective Thermal Conductivity of Printed Circuit Boards[C]. The Eighth Intersociety Conference on Thermal and Thermomechan- ical Phenomena in Electronic Systems, 2002 : 489- 494.
  • 4WERDECKER W, ALDINGER F. Aluminum Nitride- an Alternative Ceramic Substrate for High Power Appli- cations in Microcircuits[J]. IEEE Transactions on Com- ponents, Hybrids, and Manufacturing Technology, 1984, 7(4): 399-404.
  • 5BAIK Y, DREW R A. Aluminum Nitride: Processing and Applications[J]. Key Engineering Materials, 1996, 122:553.
  • 6MIYASHIRO F, IWASE N, TSUGE A, et al. High Thermal Conductivity Aluminum Nitride Ceramic Sub- strates and Packages [J]. IEEE Transactions on Com- ponents, Hybrids, and Manufacturing Technology, 1990, 13(2): 313-319.
  • 7BRUNNER D, WIENAND K. Metallized Aluminium Nitride Ceramics. Potential, Properties, Applications [J]. Interceram, 1988, 37(4): 29-32.
  • 8KUROKAWA Y, UTSUMI K, TAKAMIZAWA H, et al. A1N Substrates with High Thermal Conductivity [J]. IEEE Transactions on Components, Hyhrids, and Manufacturing Technology, 1985, 8(2): 247-252.
  • 9BUJARD P, KUHNLEIN G, INO S, et al. Thermal Conductivity of Molding Compounds for Plastic Packa- ging [J]. 1EEE Transactions on Components, Packa- ging, and Manufacturing Technology, 1994, A17 (4) : 159-163.
  • 10NAGAI Y, LAI G-C. Thermal Conductivity of Epoxy Resin Filled with Particulate Aluminum Nitride Powder [J]. Journal of the Ceramic Society of Japan, 1997, 105(3) : 197-200.

二级参考文献23

  • 1秦明礼,曲选辉,黄栋生,林健凉,肖平安,祝宝军.高热导率氮化铝陶瓷制备技术进展[J].粉末冶金材料科学与工程,2001,6(1):30-36. 被引量:3
  • 2何国新.铝源对碳热还原氮化法制备AIN粉末的影响[J].硅酸盐通报,1993,12(4):4-8. 被引量:15
  • 3黄莉萍,赵惠芬,符锡仁,董良金.添加 Y_2O_3 或 CaO 对 AlN 陶瓷的电性能和热导性能的影响[J].无机材料学报,1989,4(3):217-224. 被引量:3
  • 4[1]Sheppard L M.Aluminum nitride:A versatile but challenge material.Am Ceram Soc Bull,1990,69(11):1801~1812.
  • 5[4]Bachelard R,Joubert P.Aluminum nitride by carbothermal nitridation.Mater Sci Eng,1989,A(109):247~251.
  • 6[7]Pathak L C, Ray A K, Das S, etal. Carbothermol synthesis of Nanocrystalline aluminum nitride powders. J Am Ceram Soc ,1999, 82(1): 257~260.
  • 7[8]FumoD A, Jurado J R, Segadaes A M. Combustion synthesis of iron substituted strontium titanate perovskites. Mater Res Bull, 1997, 32(10): 1459~1470.
  • 8[9]Kingsley J J, Patil K C. A novel combustion process for the synthesis of fine particle-aluminum and related oxide materials. Mater Lett, 1988, 6(11/12): 427~432.
  • 9[10]Cho Y W, Charles J A. Synthesis of nitrogen ceramic powders by carbothermal reduction and nitridation, Part 3: aluminum nitride. Mater Sci & Tech, 1991, 7: 495~504.
  • 10Wang M C, Yang C C, Wu N C. Densification and Structure Development in the Sintering of A1N Ceramics with CaCO3 Additives[J]. J Eur Ceram Soc, 2001, 21 : 2185-2192.

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