不溶性阳极电镀锡溶液中补充Sn^(2+)的方法

Methods of Sn^(2+) Supplement in Tin-Electroplating Solution Using Insoluble Anode

回顾了电镀锡工艺所应用的两种阳极板即可溶性阳极和不溶性阳极,对比了可溶性阳极和不溶性阳极电镀锡工艺的优缺点。针对不溶性阳极电镀锡生产线镀液中锡浓度的迅速减少和自由酸含量的不断增加的问题,综述了Sn2+补充方法,化学溶锡法、置换法、溶氧法以及电解法。由于传统的化学反应溶锡法已被淘汰,置换法不利于工业化以及溶氧法产生锡泥造成锡损失等问题,对电解法的发展方向进行了展望。

In this paper, the two kinds of anode in tin-electroplating process namely soluble anode and insoluble anode were reviewed, advantages and disadvantages of the two kinds of anode in tin-electroplating process were compared. For the problems of tin content rapidly decreasing and free acid content continuously increasing in tin-electroplating solution, methods of Sn^2＋ supplement, such as chemical dissolving method, replacement method, oxygen dissolving method and electrolysis method ,were summarized. Due to the traditional chemical dissolving method had been eliminated ,replacement method was not conducive to industrialization, and oxygen dissolving method could produce tin mud which would cause the tin loss, development direction of the electrolysis method was prospected in this paper.