摘要
以环氧树脂为材料,用简单、低成本的非接触式光刻法制作多模光波导。通过实验,找出一种可靠有效的有机溶剂作为显影剂及其相应的显影时间;并研究了温湿度和旋涂工艺对光波导厚度的影响;以及光刻掩模版透光部分宽度、光刻掩模版与下包层之间的间距、曝光光强和曝光时间对光波导宽度的影响。扫描电子显微镜(SEM)对样品形貌分析表明,脊形光波导表面光滑且侧壁笔直,光波导芯横截面约为50μm×50μm。采用cut-back法,测出环氧树脂多模光波导的传输损耗为0.1dB/cm@850nm。考虑到光电集成过程中对光波导的高温冲击,对样品进行了热稳定性试验,获得的最高稳定温度为210℃。
The multimode optical waveguides are fabricated using epoxy resin materials,and the non-contact lithography is adopted as a simple and cost-effective process.A kind of reliable and efficient developer and corresponding developing time are found by a lot of experiments.and The effects of temperature and humidity,and spin-coating process on the waveguides thickness were studied;the effect of transparent portion width of lithography mask,the spacing between lower cladding layer and lithography mask,exposure intensity and time on the width of the optical waveguides are also studied.The morphology of the samples is observed by scanning electron microscopy(SEM),and the fabricated ridge optical waveguides with cross sectional size of approximately 50μm×50μm have smooth surfaces and vertical sidewalls.The transmission loss of epoxy resin multimode optical waveguides at wavelength of 850 nm is measured to be 0.1dB/cm by cut-back method.Taking account of the high temperature shock on optical waveguide during optoelectronic integrated process,the thermal stability of the fabricated optical waveguides is tested and the attainable highest thermal stability temperature is 210℃.
出处
《光电子.激光》
EI
CAS
CSCD
北大核心
2015年第8期1468-1472,共5页
Journal of Optoelectronics·Laser
基金
国家自然科学基金(61167003)资助项目
关键词
非接触式光刻
多模光波导
环氧树脂
光损耗
热稳定性
non-contact lithography
multimode optical waveguide
epoxy resin
optical loss
thermalstability