真空热压烧结制备Cu-5%TiB_2铜基复合材料研究
摘要
文章以Cn粉（3-5μm）和TiB2粉（3 μm）为原料，通过真空热压烧结制备了cu-5％TiB2复合材料。采用金相分析、x射线衍射、扫描电子显微分析和x射线能量色散谱对制备的材料进行了表征。表征结果表明：铜基复合材料在制备过程中未掺入其他杂质，TiB2颗粒均匀地分散在铜基复合材料中，材料未发现孔洞和夹杂等缺陷。
基金
浙江省质量技术监督系统科技计划项目
基金编号:20120265
浙江省公益技术研究工业项目
基金编号:2013C31063
舟山市科技计划项目
基金编号:2012C23011
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