双组分有机硅COB封装胶的制备及其性能

Preparation and Properties of Two-component Silicone Rubber for COB Encapsulation

以高黏度的甲基乙烯基MQ硅树脂和甲基含氢硅树脂为主要原料,乙烯基封端硅烷配位铂为催化剂,添加由γ-异氰酸酯丙基三乙氧基硅烷、乙烯基三甲氧基硅烷及γ-缩水甘油醚氧丙基三甲氧基硅烷组成的增粘剂,配成板上集成芯片（COB）封装用双组分有机硅装封胶。当甲基含氢硅树脂中的Si—H和甲基乙烯基MQ硅树脂中的Si—Vi的量之比为1∶1.35、增粘剂和铂催化剂的质量分数分别为2%～3%及0.15%时,COB封装胶的邵尔A硬度为为65度、拉伸强度为6.55 MPa、剪切强度为9.5 MPa、粘接强度达到1.8 MPa,综合性能最佳。

Two-component silicone rubber for Chip On Board（ COB） encapsulation was prepared by high viscosity of methyl vinyl MQ silicone resin and methyl hydrogen silicone resin as the raw materials,vinyl silane platinum as the catalyst,and adding a tackifier comprising 3-isocyanatopropyl triehthoxysilane,vinyltrimethoxysilane,and 3-glycidyloxypropyltrimethoxysilane. Results showed that when n（ Si—H） ∶ n（ Si—Vi）= 1. 35,w（ tackifier） = 2% ～ 3% and w（ platinum catalyst） = 0. 15 wt% of COB,the rubber had excellent performance with Shore hardness of 65 A,tensile strength of 6. 55 MPa,shear strength of 9. 5 MPa and adhesive strength of 1. 8 MPa.