SiC_p/Cu复合材料的导热性能研究

Thermal Conductivity Properties of SiC_p/Cu Composites

利用粉末冶金法真空热压烧结制备了SiCp/Cu复合材料,利用激光脉冲法测试了室温下复合材料的导热性能。研究发现,随着SiCp体积含量的增加,热导率逐渐下降,特别是当SiCp体积分数大于30%以后热导率急剧下降。复合材料的内部缺陷、基体Cu和SiCp颗粒之间的热膨胀失配以及界面反应是影响热导率的主要微观因素。要获得良好导热性能的SiCp/Cu复合材料,应该严格控制SiCp颗粒的体积分数在15%-30%之间。尽量提高致密度,减少烧结体内的位错、空隙等缺陷。

SiCp/Cu composites were prepared by the vacuum hot-pressed sintered technology and powder metallurgy method. The thermal conductivity of the composites at room temperature was measured by laser pulse method. The results reveal that that thermal conductivity of the alloy is decreased gradually with the increase of SiCp volume fraction, especially the volume fraction more than 30% SiCk. The thermal conductivity of the composites is related with internal defects, the mismatch between copper and SiCp particle as well as interface reaction. In order to prepare composites with good thermal conductivity properties, volume fraction of SiCp particles should be controlled strictly at 15 % to 30% to improve density and reducing the dislocations, voids and other defects.