倒角砂轮使用寿命研究

On Service Life of Chamfering Wheel

在硅片倒角过程中,影响到硅片边缘质量的因素很多,主要是主轴精度、Y轴端跳、砂轮金刚石密度等。设备参数中切入量对倒角边缘质量影响也很大,切入量越小,边缘质量越好,硅片边缘出现崩边、亮点的几率也越小。设备本身的冷却水也很重要,当冷却水流量达到一定量时,降低砂轮与硅片接触位置的表面温度,进而提高硅片边缘的倒角质量,同时延长砂轮使用寿命。通过倒角砂轮使用实验,来确定影响砂轮使用寿命的因素有哪些,并对砂轮的选用给出建议。

In the process of wafer chamfer, there are many factors affecting the quality of wafer edges, mainly including spindle precision, Y axis end jump and diamond grinding wheel density. For equipment parameters, entry amount also affects the quality of edge chamfering. The less the entry amount is, the better the quality of small edge will be and the less wafer edge chipping and bright spot will appear. Cooling water of the device itself is also very important. When the flow rate of cooling water reaches a certain value, reduce the surface temperature of the contact position between grinding wheel and wafer to improve the quality of wafer edge and prolong service life of the grinding wheel. Through an application experiment of chamfering wheel, factors affecting the use life of the wheel were determined and suggestions on wheel selection were proposed.