以铜为基质的首饰表面无氰镀银工艺的研究

Study of the jewelry surface cyanide-free silver plating technology with copper as matrix

根据无氰镀银工艺体系中不同影响因素设计多组实验,获得电镀液的组成及最佳工艺条件,并应用于铜首饰及其工艺品,使其具备银首饰的美丽外观。

A number of experiments has been designed according to the different influence factors of the cyanide-free silver plating process to obtain the electroplating solution and the optimum process conditions.The experiment results will be applied to the process of copper jewelry and copper handicraft to give them a beautiful appearance as the silver jew-elry.