摘要
针对大功率LED热流密度高的问题,提出一种基于切削铜(Cu)纤维烧结的微型换热器水冷散热系统。实验研究了烧结切削Cu纤维的孔隙率以及复合形式对LED芯片表面温度和换热器进出口压降的影响规律。实验结果表明,对于单一型烧结纤维微型换热器,在入口流量相同的情况下,孔隙率为80%的烧结纤维微型换热器对芯片表面的散热性能最优,而孔隙率为75%的烧结纤维微型换热器压力损失最大;对于复合型烧结纤维微型换热器,在入口流量相同的情况下,复合Ⅲ型(80~85%)烧结纤维微型换热器的散热性能最好,而复合Ⅰ型(75~80%)烧结纤维微型换热器的进出口压降最大。
In this work,a water cooling system based on the micro heat exchanger with sintered cutting copper fibers is put forward to meet the requirements of heat dissipation for the high power LED. The effects of different porosities and different composite forms of sintered cutting copper fibers on the chip's surface temperature and the pressure drop between the import and export of the micro heat exchanger are experimentally investigated. As for the micro heat exchangers with simple sintered cutting copper fi- bers,the results of experiment indicate that the micro heat exchanger with the porosity of 80% presents the best performance of heat dissipation on the chiprs surface temperature, whereas the micro heat ex- changer with the porosity of 75% has the largest pressure loss between the import and export at the same condition of inlet flow rate. As for the micro heat exchangers with composite forms of sintered cut- ring copper fibers, the results of experiment show that the heat exchanger with the composite-porosity of 80 %- 85% has the best heat dissipation performance on the chiprs surface temperature, while the micro heat exchanger with the composite-porosity of 75%- 80% has the largest pressure drop between the import and export at the same condition of inlet flow rate.
出处
《光电子.激光》
EI
CAS
CSCD
北大核心
2015年第9期1678-1684,共7页
Journal of Optoelectronics·Laser
基金
广东省工业攻关(2012B010500021)
广州市珠江科技新星(2013J2200060)资助项目