摘要
随着印制电路板集成化程度越来越高以及"无铅化"的全面实施,金属化孔需要承受的挑战和冲击也越来越多,比过去更容易出现各种缺陷。文中对最常见的缺陷进行了分类和原因解析,从生产工艺和药水控制方面给出了改善措施。
The plated through hole in the printed circuit boards has to endure more challenges and thermal shocks with the higher integration scale of PCB and the full implementation of＂Lead-free＂ policy. So defects are more prone to occur. In this paper, the common defects are classified and the factors which cause the defects are analyzed. The improvement measures are given from the view of production process and the control of chemical solution.
出处
《印制电路信息》
2015年第10期49-53,共5页
Printed Circuit Information
关键词
印制电路板
孔金属化
常见缺陷
预防措施
改善
Printed Circuit Board
Plated Through Hole
Common Defects
Improvements
