摘要
在红外成像系统中,串扰会降低图像的清晰度,影响焦平面阵列的分辨率性能和成像质量,因此对串扰的测试及产生机理等研究至关重要。对比了串扰效应的3种测试原理和测试方法,从光学串扰和电学串扰两个方面揭示了串扰效应的产生机理,综述了两种串扰类型的解决方案,并对未来红外成像器件的发展趋势进行展望,以期为改进相关器件的技术、结构和制造工艺提供有益的借鉴。
In infrared imaging system, crosstalk reduces definition of the image, affects the resolution performance and the imaging quality of focal plane array. Therefore, it is necessary to study the test and generation mechanism of crosstalk. Three types of testing methods and principle of crosstalk effect are compared, generation mechanisms are elaborated from two aspects of optical crosstalk and electrical crosstalk, and solutions of crosstalk are systematically summarized. At the same time, the future development trend of the infrared imaging device are also discussed. In order to offer beneficial reference for improving the relative device technology, structure and manufacturing process.
出处
《激光与光电子学进展》
CSCD
北大核心
2015年第10期26-33,共8页
Laser & Optoelectronics Progress
关键词
成像系统
红外
串扰
光学串扰
电学串扰
imaging systems
infrared
crosstalk
optical crosstalk
electrical crosstalk
