聚酰亚胺薄膜烧结铜扁线附着性的影响因素

Influence Factors on Adhesion of Polyimide Film Sintered Copper Flat Wire

对铜扁线的表面质量、烧结温度、压轮、感应线圈的加热方式以及聚酰亚胺薄膜F-46胶层厚度等因素对聚酰亚胺薄膜烧结铜扁线附着性的影响进行分析,对具有不同附着性的烧结线进行了扭转测试。结果表明：要获得最佳的附着性,须对铜扁线进行抛光处理,烧结温度控制在270~290℃,压轮在烧结线表面的下压距离为0.5~1.0 mm,采用开口式矩形感应线圈加热时铜扁线横向偏移感应线圈几何中心位置在1 mm以内,聚酰亚胺薄膜厚度允许时应采用F-46胶层较厚的薄膜。为保证聚酰亚胺薄膜烧结铜扁线满足后续的加工要求,3.35 mm×9 mm烧结线绝缘层失去附着性的长度最大不应超过4 mm。

The effects of surface quality of copper flat wire, sintering temperature, pinch roller, heating modes of induction coil, and the thickness of F-46 layer in polyimide film on the adhesion of polyimide film sintered copper flat wire were studied, and the sintering wires with different adhesion were conducted torsion test. The results show that in order to get the best adhesion, the copper flat wire should be polished, the sintering temperature should be controlled between 270 ℃ and 290 ℃, the compress distance of pinch roller on the sintering wire surface is 0.5~1.0 mm, the lateral deviation distance to geometric center of induction coil should be within 1 mm when the opening type rectangular induction coil is heating, and the polyimide film should use thicker F-46 layer when its thickness is allowed. To ensure the polyimide film sintered copper flat wire meeting the requirements of subsequent processing, the maximum length of insulation layer lost adhesion for 3.35 mm ＆#215; 9 mm sintered copper wire should be less than 4 mm.