摘要
采用分子动力学方法研究了电子封装界面铜/环氧树脂相互作用能,并考虑环氧树脂交联程度、温度和含湿量的影响.研究结果表明,环氧树脂交联程度对铜/环氧树脂界面相互作用能几乎没有影响,而高温和高湿都会使铜/环氧树脂界面黏结性能明显下降.分析表明,湿气含量较高时,湿气穿越环氧树脂层聚集在铜与环氧树脂之间.
The effects of crosslink conversion,temperature and moisture content on the interaction between copper and epoxy were investigated by the molecular dynamics simulation. It was showed that the interaction energy of Cu / epoxy resin was almost independent of the crosslink conversion of the epoxy resin,whereas it was weakened by increasing temperature and moisture content. Meanwhile,it was revealed that moisture concentrated at the Cu / epoxy interface. A comprehensive understanding of the interfacial degradation and a useful tool for developing new adhesives were provided.
出处
《郑州大学学报（理学版）》
CAS
北大核心
2015年第3期73-76,共4页
Journal of Zhengzhou University:Natural Science Edition
基金
国家自然科学基金资助项目
编号11402164
福建省自然科学基金资助项目
编号2015J05001
福建省中青年教师教育科研项目
编号JA14220
福建工程学院科研启动基金
编号GY-Z14070
广东省博士启动基金
编号S201304001676
关键词
分子动力学
相互作用能
高温高湿
molecular dynamics
interaction energy
hot and humid environment
