摘要
提出了一种LED光源黑化失效检测分析流程,分析了LED片式COB光源黑化失效的形成原因。将黑化失效的芯片剥离面用扫描电镜(SEM)等检测仪器对发黑区域进行定位,借助能谱仪(EDS)对发黑区域进行组分分析,确定光源黑化是荧光胶局部碳化所致。有限元模拟分析和验证性实验进一步说明片式COB光源黑化的主要原因是苯基类荧光胶结构中苯环裂解。
A process of blackened failure test and analysis of LED lighting source was put forward, and the cause of blackened failure of plate LED COB lighting source was analyzed. Peeling chip and scanning electron microscopy (SEM) and other detecting instrument were used to achieve the position of the black zone, and energy dispersive spectroscopy (EDS) was used to analyze the component of black area to determine that the blackened failure type was that partial phosphor glue was carbonized. By means of the finite element simulation and verification experiment, the main reason for blackened failure was further proved to be that benzene in phenyl phosphor glue structure was cracked.
出处
《电子工艺技术》
2015年第5期249-252,共4页
Electronics Process Technology
基金
广东省产学研计划基金项目(项目编号:2013B090600031)
关键词
LED失效
黑化
片式COB
荧光胶碳化
有限元
LED failure
Blackened failure
Plate COB
Phosphor glue carbonization
Finite element