某S波段TR组件组装工艺研究

Assembly Process Research of S Wave Band TR Module

随着TR组件工作频率和集成度越来越高,其组装工艺可靠性的要求也越来越高。TR组件的组装涉及微波基板上多种封装元器件在印制板上的装焊和印制板与屏蔽盒体的组装。通过工艺试验,从工艺流程设定和重要工序工艺参数设置,介绍了一种组装工艺。产品测试结果表明,组装工艺满足要求,保证了产品质量的可靠性。

The requirement on assembly process reliability of TR module is also gradually increasing, with the trend of the increasing working frequency, increasing integration and gradual miniaturization of TR module. TR module assembly relates to the soldering assembly of multiplicate packages micro-chip components on printed circuit and the assembly of printed circuits in the shielding box. Through the process test, an assembling process is introduced to ensure the reliability of the above-mentioned two processes, from technological process setting and technological parameters setting of important processes. The assembling process is showed to meet the requirements by test results of the products.