40Cr表面涂覆Cr层后电子束重熔工艺分析

Analysis on Surface Remelting Process with Electron Beam After 40Cr Coated Cr Layer

针对40Cr需要提高表面性能的需求,采用磁控溅射对40Cr表面涂覆Cr层,利用电子束对涂层表面进行照射重熔。通过扫描电镜、XRD衍射仪、硬度测量仪等观察分析不同电子束工艺参数处理后的表面形貌、界面组织、元素扩散情况,并检测表面硬度。结果表明:40Cr表面涂覆Cr层后经电子束工艺处理,表面形成大量的熔坑并伴有较清晰的"褶皱"形貌,适当的照射电压、次数能使涂层与基体发生重熔并伴有明显的元素扩散,重熔工艺会使材料表层晶粒细化,在较小脉冲次数的工艺参数下,涂层表层会有新物相产生,随照射次数增加,材料表面硬度提高。

To improve the surface properties of 40Cr, Cr coating was made on 40Cr with megnetron sputtering and its surface was remelted by electron beam. Surface topography, interface microstructure, elements diffusion and surface hardness were analyzed in different technological parameters. The results show that lots of volcanic melting pits and clear fold morphologies appeare on the surface. When the adaptable voltage and times parameters are choosed, the coating and matrix can be remelted with obvious elements diffusion, and grains on surface layer are refined after electron beam irradiation. New phases can be obtained under low pulsed times and the surface hardness is improved with the increase of irradiated times.