期刊文献+

Monitoring the Diffusion Layer During Passive Film Breakdown on Alloy 800 with Digital Holography 被引量:2

Monitoring the Diffusion Layer During Passive Film Breakdown on Alloy 800 with Digital Holography
原文传递
导出
摘要 The effects of chloride and thiosulfate ions on localized corrosion of alloy 800 are investigated through dynamical observation of the change in phase image of the diffusion layer during passive film breakdown using digital holography. The results indicate that solution chemistry has a significant effect on film breakdown and diffusion layer. The phase distribution changes at different applied potentials show that in the process of film breakdown, dissolution of metal ions from pitting is not remarkable in chloride-only solution, whereas dissolution of metal ions is significantly high in thiosulfate and chloride solution. Thiosulfate has a combined effect with chloride ions in passive film degradation. The effects of chloride and thiosulfate ions on localized corrosion of alloy 800 are investigated through dynamical observation of the change in phase image of the diffusion layer during passive film breakdown using digital holography. The results indicate that solution chemistry has a significant effect on film breakdown and diffusion layer. The phase distribution changes at different applied potentials show that in the process of film breakdown, dissolution of metal ions from pitting is not remarkable in chloride-only solution, whereas dissolution of metal ions is significantly high in thiosulfate and chloride solution. Thiosulfate has a combined effect with chloride ions in passive film degradation.
出处 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2015年第9期1170-1174,共5页 金属学报(英文版)
基金 supported by Natural Sciences and Engineering Research Council of Canada Discovery Grant National Natural Science Foundation of China (No. 51371124)
关键词 Passive film BREAKDOWN Diffusion layer Digital holography Alloy 800 Passive film Breakdown Diffusion layer Digital holography Alloy 800
  • 相关文献

参考文献23

  • 1L. Fan, Z. Y. Liu, W. M. Guo, J. Hou, C.W. Du, X.G. Li, Acta Metall. Sin. (Engl. Lett.) 28, 866 (2015).
  • 2A. Parsapour, S. Khorasani, M. Fathi, Acta Metall. Sin. (Engl. Lett.) 26, 409 (2013).
  • 3Y. Zhang, B. Chen, Z. Guo, Acta Metall. Sin. (Engl. Lett.) 27, 331 (2014).
  • 4D.H. Xia, L.X. Yang. Acta Phys-Chim Sin. 30, 1465 (2014).
  • 5D.H. Xia, S.Z. Song, W.Q. Gong, Y.X. Jiang, Z.M. Gao, J.H. Wang, J. Food Eng. 113, 11 (2012).
  • 6D.H. Xia, S.Z. Song, J.H. Wang, H.C. Bi, Z.W. Han, Trans. Tianjin Univ, 18, 15 (2012).
  • 7C. Thee, L. Hao, J.H. Dong, X. Mu, W. Ke, Acta Metall. Sin. (Engl. Lett.) 28, 261 (2015).
  • 8J. Li, H.J. Zheng, Y. Zheng, W.K. Kong, K. Wang, Acta Metall. Sin. (Engl. Lett.) 28, 449 (2015).
  • 9N. Cui, H,Y. Ma, J,L. Luo, S. Chiovelli, Electrochem, Commun, 3, 716 (2001).
  • 10R.K. Zhu, J.L. Luo, Electrochem. Commun. 12, 1752 (2010).

同被引文献10

引证文献2

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部