期刊文献+

电动大巴逆变器用管式冷板传热性能研究 被引量:4

Heat Transfer Research on Tube Cold Plate for an Inverter Used in the Electrical Bus
下载PDF
导出
摘要 研究电动大巴逆变器用冷板的流道结构问题,针对平板式S型流道冷板均温性差、易泄露,影响元器件寿命及逆变器系统工作的稳定性等问题,设计了一款改进S型流道压管式冷板散热器。根据传热理论采用有限元软件ICEPAK建立了逆变器系统散热的各冷却流道冷板物理模型,对U型与S型流道冷板的温度场分布和流道压降进行模拟仿真,对比分析了改进S型流道冷板的均温性能和流道压降。仿真结果表明:在相同的进口流量和进口温度下,改进S型流道冷板温度分布更加均匀且流道压降相对较小。在此基础上,对流道进口流量进行进一步优化得到最优流量参数。最后试制样机,仿真和试验结果验证了改进S型流道冷板具有较好的流动换热综合性能。 For the bad temperature uniformity and leakage of plate type water - cold radiator, which make effect on components service life and inverter working stability, a new S - shaped channel tube cold plate on the basis of study on flow channel structure is designed for electrical bus in this paper. Based on the theory of heat transfer, the simulation model of different water - cooling flow channel is established by the finite element software ICEPAK. The temperature field and pressure drop of U - shaped and S - shaped channel cold plates are simulated and compared with the new S -shaped channel cold plate. The results indicate that the new S -shaped channel cold plate has bet- ter temperature uniformity and lower pressure drop under conditions of the same inlet flow and the same temperature. The inlet flow rate is designed with the final optimal parameters. The comparison results of simulation and experiment indicate that the new cold plate has the best flow and thermal performance in cooling by prototype testing.
出处 《计算机仿真》 CSCD 北大核心 2015年第10期177-181,共5页 Computer Simulation
基金 上海市科技创新基金项目(1404H118100)
关键词 逆变器 管式冷板 温度场 压降 Inverter Tube cold plate Temperature field Pressure drop
  • 相关文献

参考文献12

  • 1B Ramos - Alvarado, et al. CFD study of liquid - cooled heat sinks with microchannel flow field configurations for electronics, fuel cells, and concentrated solar ceils [ J ]. Applied Thermal En- gineering, 2011,31 (14) :2494 - 2507.
  • 2S Maharudrayya, S Jayanti, A P Deshpande. Flow distribution and pressure drop in parallel - channel configurations of planar fuel cells[ J]. J 1 of Power Sources, 2005,144( 1 ) :94 - 106.
  • 3揭贵生,孙驰,汪光森,聂子玲,孟庆云.大容量电力电子装置中板式水冷散热器的优化设计[J].机械工程学报,2010,46(2):99-105. 被引量:40
  • 4Y Chen, et al. Fast approach of Pareto - optimal solution recom- mendation to multi - objective optimal design of serpentine - chan- nel heat sink [ J ]. Applied Thermal Engineering, 2014,70 ( 1 ) : 263 - 273.
  • 5张新鹏,张广泰,张辉亮,赵盛国.螺旋流道水冷IGBT散热器数值模拟及试验研究[J].电力电子技术,2014,48(2):71-73. 被引量:16
  • 6I Swan, et al. A fast loss and temperature simulation method for power converters, Part II: 3 - D thermal model of power module [ J]. Power Electronics, IEEE Transactions on, 2012,27( 1 ) :258 - 268.
  • 7T Y T Lee. Design optimization of an integrated |iquid - cooled IG- BT power module using CFD technique [ J ]. Components and Packaging Technologies, IEEE Transactions on, 2000, 23 ( 1 ) : 55 - 60.
  • 8程鹏,兰海,罗耀华.整流器件热分析及其风冷散热器的仿真研究[J].计算机仿真,2011,28(11):275-278. 被引量:15
  • 9T M Jeng, S C Tzeng, Y C Yang. Detailed measurements of heat transfer coefficients in a 180 - deg rectangular tamed channel with the perforation divider[ J ]. International Joumal of Heat and Mass Transfer, 2011,54 (23) : 4823 - 4833.
  • 10S Maharudrayya, S Jayanti, A P Deshpande. Flow distribution and pressure drop in parallel - channel configurations of planar fuel cells [ J]. Journal of Power Sources, 2005, 144, ( 1 ) :94 - 106.

二级参考文献23

  • 1刘衍平,高新霞.大功率电子器件散热系统的数值模拟[J].电子器件,2007,30(2):608-611. 被引量:24
  • 2李永东.高性能大容量交流电机调速技术的现状及展望[J].电工技术学报,2005,20(2):1-10. 被引量:48
  • 3徐德好.微通道液冷冷板设计与优化[J].电子机械工程,2006,22(2):14-18. 被引量:24
  • 4THOMAS B, DONALD G H. Optimal pulse width modulation for three-level inverters[J]. IEEE Trans. Power. Elec., 2001, 20(1): 41-47.
  • 5HEFNER A R. A dynamic electro-thermal model for the IGBT[J]. IEEE Trans. lnd. Applicat., 1994, 30(2): 394- 405.
  • 6CHAN Suyun, PAOLO M, MAURO C, et al. Thermal component model for electrothermal analysis of IGBT module systems[J]. IEEE Trans. Advanced Packing, 2001, 24(3): 401-406.
  • 7RAEL S, SCHAEFFER C, PERRET R. Electrothermal characterization of IGBT[C]// Proceeding of IEEE- IAS'94, Denver, CO, Oct.2-5,1994:1 336-1 343.
  • 8KEVIN A M, YOGENDRA K J, GERHARD H S. Thermal characterization of a liquid cooled AISiC base plate with integral pin fins[J]. IEEE Trans. Comp. Packaging Technol., 2001, 24(2): 3-10.
  • 9KNIGHT R W, HALL D J, GOODLING J S, et al. Heat sink optimization with application to microchannels[J]. IEEE Trans. Comp. Hybrids Manufact. Technol., 1992, 15(5): 832-842.
  • 10LUC Meysenc, LUCAS Saludjian, ALAIN Brieard. A high heat flux IGBT micro exchanger setup[J]. IEEE Trans. Comp. Hybrids Manufaet. Technol., 1997, 20(3). 334-341.

共引文献63

同被引文献33

引证文献4

二级引证文献15

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部