基于FPGA的BGA焊点健康管理原理与实现

Theory and Implementation of BGA Solder Joint Health Management Based on FPGA

针对BGA封装的FPGA焊点故障频发、现有的检测手段非常有限的问题,提出了一种基于FPGA的BGA焊点失效监测模型及实现方法;从制造生产因素和环境应力两方面对FPGA的BGA焊点失效因素进行了分析;建立失效检测模型,首先根据欧姆定律确定了检测原理,接着基于IPC7095B确定了焊点易失效区域,最终依据电容充放电时间与端电压的关系确定了检测方法;通过逻辑编码和基于Xilinx公司V5系列FPGA的实现,表明该方法可用于对FPGA的BGA焊点健康信息的管理,并根据不同的检测标准对检测情况进行了比较。

For FPGA BGA package solder joint failures occur frequently, the existing detection means very limited, presents a FPGA-- based BGA solder joint failure monitoring Models and Methods; analyzed the FPGA＇s BGA solder joint failure factors from manufacturing and environmental stress ; establish failure detection model, first determine the detection principle according to Ohm＇s law and IPC7095B, according to the relationship between capacitor charging and discharging time and the terminal voltage to determine the detection method; by logic coding and V5 series based on Xilinx Inc. FPGA implementations show that this method can be used to manage the FPGA BGA solder joint health information, and according to different testing standards for testing situation compared.