摘要
构建简化的IGBT三维模型及焊料层二维模型,分析焊料层受热应力产生的塑性形变对器件热阻的影响。弹塑性仿真分析表明,焊料层的塑性形变导致细小裂纹的出现,这些细小的裂纹在周期性的热应力的作用下逐渐地变大,最终形成比较明显的空洞,从而使得器件的热阻变大。
A simplified three-dimensional model of IGBT and a two-dimensional model of solder layer are constructed, and the influence of plastic deformation of solder layer caused by thermal stress on the resistance of component is analyzed. The elastic plastic simulation analysis shows that the plastic deformation of the solder layer will lead to the emergence of small cracks. And under the influence of the periodic thermal stress, these tiny cracks will gradually become larger and larger and form obvious hollow in the end, which will make the resistance of component become larger.
出处
《电子产品可靠性与环境试验》
2015年第5期20-23,共4页
Electronic Product Reliability and Environmental Testing