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含硼有机硅树脂的合成及其耐高温性能的研究 被引量:4

Synthesis and heat-resistant performance of silicon resin Contained with boron
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摘要 硼酸和含羟基的有机硅树脂预聚体通过缩聚反应,制备了系列含硼有机硅树脂(BSR)。红外光谱(FT-IR)测试表明,硼元素以Si—O—B—O—Si键掺入到有机硅树脂中。探讨了水用量、水解温度、单体配比、硼硅物质的量比等对树脂合成及其耐热性能的影响。结果表明:当水用量为60%、水解温度为65℃、单体配比R/Si为1.2、硼硅物质的量比n(B—OH)/n(Si—OR)为1∶5时,合成反应较平稳,无凝胶现象,树脂的耐受温度达到390℃以上,与纯有机硅树脂相比得到显著提高。 A series of silicon resins contained with boron(BSR)were prepared by polycondensation of boric acid and organic silicon resin prepolymer with hydroxyl group.The results from fourier transform infrared spectroscopy(FT-IR)showed that boron as doping element was introduced into the silicone resin as Si—O—B—O—Si.The following studies were focused on the influences of the hydrolysis percentage,the hydrolysis temperature,the ratio of monomer and the ratio of boron and silicon,on the synthesis and the heat-resistant property of BSR.The reaction was stable and there was no gel phenomenon during the process of synthesis on optimum experimental condition which the hydrolysis percentage was 60%,hydrolysis temperature was 65℃,the monomer ratio(R/Si)was 1.2,the ratio of boron and silicon(nB—OH/nSi—OR)was1∶5.The results indicated that the heat resistant temperature of the obtained BSR was as high as 390℃,which showed that the thermal stability of the silicone resin was improved greatly after element boron was doped into the main chain.
出处 《化工新型材料》 CAS CSCD 北大核心 2015年第10期70-72,共3页 New Chemical Materials
基金 广东省科技计划项目(2012B010200034)
关键词 有机硅树脂 硼酸 水解 聚合 热稳定性 organic silicon resin boron acid hydrolysis polymerization thermal stability
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