低压成套设备中铜铝复合母线温升的研究

Study on temperature rise of TLF bus bar within complete sets of low voltage equipment

铜铝复合母线(TLF bus bar)是一种新型铜包铝结构的复合导体材料,此材料既保持了铜母线(copper bus bar)表面抗氧化能力强的特点,又具有铝资源多,质量轻,价格低的优点,是替代铜母线的极佳材料。本文实验研究了相同电流规格下的铜母线及铜铝复合母线温升与截面积的关系,分析了低压成套设备中铜铝复合母线替换铜母线的技术参数。结果表明:铜铝复合母线宽度增加20%或厚度增加33%即可有效取代铜母线。

TLF bus bar is a new conductor composite material with copper-clad aluminum structure, and it keeps both the surface antioxidant ability from copper bus bar and the advantages from aluminum such as abundant resources, light weight, low-cost, etc., which make it the best material to replace copper bus bar. The relationship between temperature rise and sectional area in both copper bus bar and TLF bus bar under the same ampere rating was studied by experimental, and the technical parameters which are used to replace copper bus bar with TLF bus bar within complete sets of low voltage equipment were also analyzed. The results show that TLF bus bar could be an effective alternative to copper bus bar when its width is increased by 20% or the thickness is increased by 33%.