摘要
运用有限元软件ANSYS建立了采用叠层焊点的塑料球栅阵列(Plastic Ball Grid Array,PBGA)结构有限元分析模型,基于该模型对PBGA结构在典型工作环境下的稳态温度场分布进行了模拟,对比传统单层焊点与叠层焊点对PBGA结构温度场的影响,并分析了焊点高度和PBGA结构各部分材料导热系数对内部温度的影响。结果表明:焊点结构形式(单层和叠层)和焊点高度对PBGA组件温度场影响不大;PCB的导热系数对PBGA组件温度场影响最大,其次是塑封和基板,粘结剂对PBGA组件温度场影响很小。
The steady-state temperature distribution under the typical operating environment of plastic ball grid array （PBGA） using stacked solder joints was analyzed based on the method of finite element software ANSYS analysis simulation. The influence of traditional singleply and stacked solder joints on PBGA assembly temperature field was compared, and the influence of solder joint height and various parts of PBGA component thermal conductivity on the internal temperature was analyzed. Results show that the solder joint structure （single and stacked） and the height of solder joint have little effect on the temperature field of PBGA components; the thermal conductivity of PCB has the largest effect on temperature field of PBGA assembly, followed by plastic package and substrate, the adhesive has little effect on PBGA component temperature field.
出处
《电子元件与材料》
CAS
CSCD
2015年第11期96-99,共4页
Electronic Components And Materials
基金
国家自然科学基金项目资助(No.51465012)
广西教育厅项目资助(No.KY2015LX330)
广西自然科学基金项目资助(No.2012GXNSFAA053234
No.2013GXNSFAA019322)
河池学院项目资助(No.2014QN-N003)
