切割液性能对切割行为影响的研究进展

Research Progress on the Influence of Cutting Fluid Properties on Cutting Behavior

在晶硅片切割领域,切割液应与切割方式相匹配。切割液作为切割耗材之一,其性能直接影响硅片切割质量。本文综述了切割液的分类、切割液对切割方式的作用机理;并分析了切割液的渗透性、润滑性、导热性、切割液粘度、p H及其螯合作用对切割行为的影响。结合切割方式的发展及切割液自身特点,展望未来切割液的发展方向。

In the field of silicon wafers cutting,the cutting fluid should mach the different cutting way. As one of the cutting material,the properties of cutting fluid directly affect the quality of wafer. Classification of cutting fluid and the mechanism for cutting mode were reviewed. The influence of cutting fluid properties on the cutting behavior were analyzed in detail,which contained the permeability,lubricity,thermal conductivity,viscosity,p H and chelating properties.Finally,combining the development of the cutting way and the trait of the cutting fluid,the development direction of cutting fluid was prospected.