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瓷砖抛光过程建模与仿真 被引量:2

The Modeling and Simulation Study upon Ceramic Tile Polishing Process
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摘要 瓷砖的抛磨影响因素众多,实际磨削加工时容易出现漏抛、返抛现象。对陶瓷抛光机磨头进行运动学分析,并基于不同粒度号的磨粒在一定压力下的加工深度模型,探讨抛光机磨头转速、横梁摆动频率、传送速度对瓷砖抛光加工表面均匀性的影响,然后结合磨削机理使用MATLAB软件对陶瓷抛光过程进行仿真。最后使用多组不同的运动参数进行模拟试验,分析不同条件下抛光的均匀性影响。 Many factors affect the polishing of ceramic tile. In the actual grinding process, it is easy to occur the phenomenon of without polishing in certain areas or polishing again. This paper mainly analyzes kinematics of polishing head in polisher and based on the model of grinding depth under certain pressure with different grain size, studies the influence of rotational speed of the abrasive disk, frequency of the lateral oscillation forward and speed of the polishing line on homogeneity of polishing surface, then combined with the grinding mechanism, using MATLAB software to simulate the polished ceramic process modeling. Finally, using multiple groups of different parameters to simulate, analyzed the effects of the uniformity in different conditions of polishing.
作者 朱成就
出处 《机电工程技术》 2015年第10期61-65,共5页 Mechanical & Electrical Engineering Technology
基金 广东省自然科学基金(编号:501130093)
关键词 陶瓷抛光机 均匀性 运动参数 仿真 polisher uniformity movement parameter simulation
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参考文献7

  • 1Sousa FJP, Aurich JC, Weingaertner WL, Alarcon OE.Kinematics of a single abra-sive particle during the in-dustrial polishing processof porcelain stoneware tiles[J] . J Eur Ceram Soc2007, 27 (10):3183-90.
  • 2Fdbio J. P. Sousa, Jan C.Aurich. Optimization of theKinematics Available in thePolishing Process of Ceram-ic Tiles by ComputationalSimulations [j] . Journalof the American CeramicSociety Volume 92,pages41-48, 2009.
  • 3许雄超,王世旺.基于陶瓷抛光机抛磨运动建模及试验研究[J].机械设计与制造,2008(9):132-134. 被引量:4
  • 4陈彩如,谭建平.大规格陶瓷砖抛光过程仿真与试验研究[J].中国陶瓷,2008,44(2):45-47. 被引量:20
  • 5纪宏波,彭岩,周芬芬,郭伟刚,吕冰海.氧化锆陶瓷平面零件超精密研磨实验的研究[J].机电工程,2013,30(9):1059-1062. 被引量:12
  • 6Jiang J, Ge P, Hong J. Study on micro-interactingmechanism modeling in grinding process and ground sur-face roughness prediction [j] . The International Journalof Advanced Manufacturing Technology, 2013, 67(5-8): 1035-1052.
  • 7任敬心,华定安.磨削原理[M].北京:电子工业出版社,2011.

二级参考文献22

  • 1郭力.工程陶瓷高效深磨工件表面粗糙度研究[J].湖南文理学院学报(自然科学版),2007,19(4):69-73. 被引量:2
  • 2温革,王振林,向明,罗贤海.基于Matlab陶瓷墙地砖抛光运动模拟分析[J].陶瓷学报,2004,25(4):239-244. 被引量:4
  • 3余鑫萌,徐宝奎,袁发得.二氧化锆的稳定化及其应用[J].稀有金属快报,2007,26(1):28-32. 被引量:30
  • 4路顺,林健,陈江翠.氧化锆氧传感器的研究进展[J].仪表技术与传感器,2007(3):1-3. 被引量:31
  • 5李伯明,赵波.现代磨削技术[M].北京:机械工业出版社,2003.
  • 6Chih-Cheng Wang, Shih-Chieh Lin, Hong Hochen. A material removal model for polishing glass ceramic and aluminum magnesium storage disks[J]. International Journal of Machine Tools & Manufacture, 2002, 421 979 - 984.
  • 7I.M. Hutchings K. Adachi, et al. Analysis and laboratory simulation of an industrial polishing process for porcelain ceramic tiles[J]. Journal of the European Ceramic Society, 2006, 25. 3151- 3156.
  • 8PICONI C, MACCAURO G. Zirconia as a ceramic biomate- rial [ J ]. Biomaterials, 1999,20 ( 1 ) : 1-25.
  • 9COSENTINO I C, MUCCILLO E N S, MUCCILLO R. Devel- opment of zirconia-titania porous ceramics for humidity sen- sors [ J ]. Sensors and Actuators B ,2003,96( 3 ) :677-683.
  • 10KASAI T, HARIO K, KARAKI D T. Improvement conven- tional polishing conditions for obtain super smooth surface of compound semiconductor wafers [ J ]. Annals of CIRP, 1990,39( 1 ) :432-437.

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