摘要
集成电路芯片的内部互联主要使用键合技术。本文简要介绍了集成电路封装的三种键合方式及其原理;对目前广泛使用的键合金丝、键合铝丝、键合铜丝的性能进行了分析和对比,突出了键合铜丝替代传统键合材料的优势,并对改进的镀钯键合铜丝进行了介绍;最后从政策、供求等方面对键合铜丝的市场发展趋势进行了分析。
The internal interconnection of IC chip mainly used bonding technology. Three bonding process and principle in the IC packaging is reviewed in the paper; The properties of gold wire, aluminium wire are analysed and compared with copper wire, and the copper＇s advantage in the alternative to the traditional bonding materials is highlighted. Then the Pd--plated copper bonding wire is introduced. Finally, according to the policy,supply and demand etc., the market trend of copper bonding wire is analyzed.
出处
《有色矿冶》
2015年第5期60-63,共4页
Non-Ferrous Mining and Metallurgy
关键词
IC封装
引线键合
键合铜丝
IC packaging
wire bonding
copper wire bonding
