摘要
采用二次通用回归旋转组合设计方法,对KDP晶体的切削加工工艺进行优化设计;利用单点金刚石飞刀切削(single point diamond turning,SPDT)技术对其进行切削。对试验结果进行测量与分析,确定合理的试验因素及水平,分析加工工艺参数的单因素和交互因素对KDP晶体表面粗糙度的影响规律。最后得到最优工艺参数组合:刀具圆弧半径为5 mm,转速为800 r/min,进给量为1μm/r,背吃刀量为21μm,加工出的KDP晶体表面粗糙度值为0.017μm。
KDP crystal cutting process is optimized through quadratic general regression rotary unitized design; KDP crystal cutting experiments are by means of single point diamond turning. The test results are meas- ured and analyzed to determine a reasonable level of experimental factors, analyze influence of single factor and interaction factor of process parameters on KDP crystal surface roughness. Finally, the opti- mal process parameters ： tool radius of 5 mm, speed of 800 r/ min, feed rate of 1 μm /r, back cutting depth of 21μm, then the machined KDP crystal surface roughness is 0. 017μm.
出处
《制造技术与机床》
北大核心
2015年第11期139-144,共6页
Manufacturing Technology & Machine Tool
基金
国家科技重大专项(2011ZX04004-042)
关键词
KDP晶体
单点金刚石飞刀切削
二次通用回归旋转组合试验
粗糙度
单因素
交互因素
KDP crystal
single point diamond turning
quadratic general regression rotary unitized design
rough- ness
single factor
interaction factor
